||The company was established for the purpose of developing manpower saving
||Epoch-making sorting machine for resistor was developed.
||Leadless cap pressing machine was developed.
||Sales to South Asia started. Three N Co., Ltd. was established. The Kyoto
planning division was organized for business development.
||Production machine for resistor, 200 series was developed.
||Trial product of resistor trimming machine by CO2 laser was completed and
test for practical use was started.
||Development of new type capacitor manufacturing machine was started.
||Super high speed manufacturing machine series for resistor was developed.
Development of chip mounting machine was started.
||Multi-mounting machine, STM-2 was exhibited at ELECTRONICA (GERMANY).
||Muikamachi factory was completed. The STM-6 machines were delivered to
Germany and Hong Kong.
||The STM-3 multi-mounting machine started development.
||The second factory in Muikamachi was completed.
The STM-8 which is in a singlemounter for round chip was developed. Systems
such as relative hybrid IC apparatus, loader, unloader and mounter for
odd-shaped components were developed.
||Development of chip supply equipment (bulk cassette) was completed.
||Development of the STM-Y multi-mounter exclusively for rectangular chip
and also the OLB-V-S were completed.
||The head office was moved to Yoga. Construction of the Atsugi technical
center was finished. Also the ACT-1200 high speed taping machine was completed.
||The FLB-I-S flexible bonder was completed.
||Contruction of factory in Kyoto was finished.
||Contruction of factoryin Sanjyo was finished. The full auto TAB bonder
was completed with technical cooperation from Universal instruments of
||The STM-YII multi-mounter and the STM-20 series one by one mounter were
||The CCR-120 automatic silver electrode termination machine and the CBM-120
second breaking machine were completed.
||Shipment of mounters have reached a total of 520 units. The mounting tact
achieved the highest speed with a world record of 0.04 sec./chip. Also
bulk packing of transistor was completed.
||The TCP Flip chip bonder along with FPB manual and automatic bonding machines
||The third factory in Muikamachi was completed.The multi-mounting machine,
STM-YIII and the high speed taping machine, ACT-1200IT-S machine were completed.
The mounting tact achieved the highest speed with a world record of 0.03
||STM-YIII and ACT-1200IT-S were exhibited at INTERNEPCON WEST (USA).
||High speed chip taping machine NAT-1600 was completed.。
||High speed chip taping machine NAT-2000 was completed.
||40th Anniversary. Qualified to ISO9001.
||Released the improved version of the high speed chip tapingmachine of the
Released the NAIT series, the new version of chip components taping and
inspection machine of the AIT series.
||The office in Shanghai, China was opened.
||Accumulated 2000 units of the shipments of NAT Taping Machine ware accomplished, and the 4 faces appearance inspector was completed.
||NAT Taping Machine renewing the highest taping speed in the world was completed.
||NITTO KOGYO marked 45th, and Muikamachi Plant marked 25th anniversary.
New NAIT Series supporting various kinds of electronics components was
||NBT Series taping machine equipped with inductor measuring was completed.
||LAB-120 labeling machine was completed. Tokyo Engineering Development Office was opened.
||Bulk supply feeder was completed.
||Participated in the INTERNEPCON (JAPAN)
||50th Anniversary. High speed taping machine NAT-STH Series was completed.
||NAT-UM Series, the next generation high-speed taping machine, was completed.