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HISTORY
1961 The company was established for the purpose of developing manpower saving machine.
1962 Epoch-making sorting machine for resistor was developed.
1966 Leadless cap pressing machine was developed.
1973 Sales to South Asia started. Three N Co., Ltd. was established. The Kyoto planning division was organized for business development.
1974 Production machine for resistor, 200 series was developed.
1975 Trial product of resistor trimming machine by CO2 laser was completed and test for practical use was started.
1976 Development of new type capacitor manufacturing machine was started.
1978 Super high speed manufacturing machine series for resistor was developed. Development of chip mounting machine was started.
1980 Multi-mounting machine, STM-2 was exhibited at ELECTRONICA (GERMANY).
1981 Muikamachi factory was completed. The STM-6 machines were delivered to Germany and Hong Kong.
1982 The STM-3 multi-mounting machine started development.
1984 The second factory in Muikamachi was completed.
The STM-8 which is in a singlemounter for round chip was developed. Systems such as relative hybrid IC apparatus, loader, unloader and mounter for odd-shaped components were developed.
1987 Development of chip supply equipment (bulk cassette) was completed.
1988 Development of the STM-Y multi-mounter exclusively for rectangular chip and also the OLB-V-S were completed.
1989 The head office was moved to Yoga. Construction of the Atsugi technical center was finished. Also the ACT-1200 high speed taping machine was completed.
1990 The FLB-I-S flexible bonder was completed.
1991 Contruction of factory in Kyoto was finished.
1992 Contruction of factoryin Sanjyo was finished. The full auto TAB bonder was completed with technical cooperation from Universal instruments of U.S.A.
1993 The STM-YII multi-mounter and the STM-20 series one by one mounter were completed.
1994 The CCR-120 automatic silver electrode termination machine and the CBM-120 second breaking machine were completed.
1995 Shipment of mounters have reached a total of 520 units. The mounting tact achieved the highest speed with a world record of 0.04 sec./chip. Also bulk packing of transistor was completed.
1996 The TCP Flip chip bonder along with FPB manual and automatic bonding machines were completed.
1997 The third factory in Muikamachi was completed.The multi-mounting machine, STM-YIII and the high speed taping machine, ACT-1200IT-S machine were completed. The mounting tact achieved the highest speed with a world record of 0.03 sec./chip.
1998 STM-YIII and ACT-1200IT-S were exhibited at INTERNEPCON WEST (USA).
1999 High speed chip taping machine NAT-1600 was completed.。
2000 High speed chip taping machine NAT-2000 was completed.
2001 40th Anniversary. Qualified to ISO9001.
2002 Released the improved version of the high speed chip tapingmachine of the NAT Series.
Released the NAIT series, the new version of chip components taping and inspection machine of the AIT series.
2003 The office in Shanghai, China was opened.
2004 Accumulated 2000 units of the shipments of NAT Taping Machine ware accomplished, and the 4 faces appearance inspector was completed.
2005 NAT Taping Machine renewing the highest taping speed in the world was completed.
2006 NITTO KOGYO marked 45th, and Muikamachi Plant marked 25th anniversary. New NAIT Series supporting various kinds of electronics components was launched.
2007 NBT Series taping machine equipped with inductor measuring was completed.
2008 LAB-120 labeling machine was completed. Tokyo Engineering Development Office was opened.
2009 Bulk supply feeder was completed.
2010 Participated in the INTERNEPCON (JAPAN)
2011 50th Anniversary. High speed taping machine NAT-STH Series was completed.
2012 NAT-UM Series, the next generation high-speed taping machine, was completed.